JCET Group Co., Ltd. Donates 5 Million CNY for Coronavirus Prevention

On 2020 February 8th, JCET Group Co., Ltd. donated 5 million CNY via the Jiangyin Charity Federation, to support the prevention of NCP (Novel coronavirus pneumonia）. The donation included 4 million CNY to support epidemic prevention and control, patient treatment, material procurement and to help support front-line medical workers in Hubei Province. An additional 1 million CNY was for Jiangyin municipal epidemic prevention and control as well as medical supplies. In addition to the JCET Group donation, the Party Committee and the Labor Union of JCET are organizing donations with Party members and employees actively responding and donating.

“Taking responsibility” is one of the core corporate values of JCET Group Co., Ltd.. Actively participating in the effort against the epidemic is a part of JCET’s corporate social responsibilities, as we support and collaborate with the government on various prevention measures. As JCET Group is a key part of the production supply chain of medical electronic devices urgently needed in today’s market, we are working hard to meet the relevant customers’ requirements in priority while strictly executing the preventative measures and ensuring safety, all in coordination with government and relevant departments who are providing strong support. The current production and operation status of JCET Group’s China factories are stable, and the production and operation of its factories in South Korea and Singapore have only seen minor affects from the outbreak.

During this special period, JCET will work together with the community to make contributions to the prevention and control of the epidemic!

About JCET

JCET Group is a leading global semiconductor packaging and test provider, offering a full range of turnkey services that include semiconductor package design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications including mobile, communication, compute, consumer, automotive and industry etc., through advanced wafer level packaging, 2.5D/3D, System-in-Package, flip chip and wire bonding technologies. JCET Group has three R&D centers, six manufacturing locations in China, Singapore and Korea, and sales centers around the world providing close technology collaboration and efficient supply-chain manufacturing to customers in China and throughout the world. For more details please visit www.jcetglobal.com