JCET Collaborates with Well-Known Industry Clients to Develop High-Standard UWB Products for Enhanced Automotive Safety

The automotive industry is in a constant state of evolution, driven by the growing demand for improved safety, efficiency, and connectivity. As a result, car manufacturers are perpetually seeking new technologies that elevate the driving experience and provide additional benefits to consumers. One technology that has been gaining traction is the ultra-wideband (UWB), a wireless communication protocol that offers several distinct advantages.

The consumer market for UWB technology has undergone rapid development in recent years. The Car Connectivity Consortium® (CCC) incorporated UWB technology into the Digital Key 3.0 specification, paving the way for car manufacturers to introduce vehicle models equipped with UWB digital keys. This marked the official entry of UWB technology into the automotive industry. According to ICV, the UWB market is poised to reach a market size of approximately $2.256 billion by 2027, with a 6-year CAGR (Compound Annual Growth Rate) of around 69.2%.

Ultra-wideband technology operates by transmitting data across a wide range of frequencies, typically between 3.1 and 10.6 GHz. This allows for higher data transfer rates and increased accuracy. One of the most significant benefits of UWB technology in the automotive industry is its potential to improve vehicle safety. By utilizing UWB sensors, cars can accurately detect the distance, speed, and direction of surrounding vehicles, pedestrians, and obstacles. This information can then be used to optimize advanced driver assistance systems (ADAS) such as adaptive cruise control, lane-keeping assist, and collision avoidance systems.

UWB technology also enables secure and seamless vehicle access. It uses precise distance measurements to authenticate the user’s presence, making it difficult for unauthorized parties to gain access to the vehicle. In addition, UWB enhances the overall driving experience by facilitating advanced connectivity features. For example, UWB can establish a wireless communication link between the vehicle and the driver’s smartphone, allowing for seamless integration of infotainment systems, navigation, and other smartphone applications.

Key components in UWB chips include the baseband, RFIC, MCU, PMIC and eFlash. Common packaging options include LGA, QFN, WLCSP, and others.

To adapt UWB technology for automotive system applications, it is necessary to consider minimizing signal loss, reducing power consumption, and implementing the physical infrastructure of IR-UWB systems. For mobile technology systems, factors such as size, form factor, and the ultimate cost of the product, including integrated antenna integration, must also be considered. Advanced packaging technologies are expected to become the dominant trend for UWB-related products in this field.

JCET Group possesses both mature traditional packaging technologies (such as LGA and QFP) as well as advanced packaging technologies (like WLCSP and FCCSP). Its products have already achieved mass production for automotive-grade applications. As the company continues to expand the types of packaging offered, it remains committed to improving the reliability levels and cost-effectiveness of mature packaging products. The majority of JCET’s packaging products have already reached G1 and G0 standards.

To better meet market demand, JCET has formed strategic partnerships with well-known UWB chip companies both domestically and abroad. The company has collaborated with industry-leading clients in the UWB field to develop UWB solution products that adhere to the CCC (Car Connectivity Consortium) Digital Key R3 standard, and they are expected to begin mass production of automotive-grade products in 2024.

As the world’s leading integrated-circuit manufacturing and technology services provider, JCET has extensive experience in R&D and customer projects. The company looks forward to working more closely with automotive electronics customers on UWB-related products to achieve mutual success.