275 Middle Binjiang Road, Jiangyin, Jiangsu
Lot Area: 61,369 sqm
GFA: 58,235 sqm
Bumping, Wafer Level Packaging, and Test
Certifications:
ISO9001
IATF16949
ISO14001
ISO45001
ISO22301
SONY GP
ESD20.20
IEC17025
QC080000
ISO 27001
ISO 10012
ISO 14064-1:2018 (GHG Emission Review)
GB/T 29490-2013
AEO Certification