JCET’s New High-end Manufacturing Facility in Jiangyin Completes Roof Sealing Stage on Schedule

Jiangyin, Wuxi, June 21, 2023 - The "JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project" has completed the roof-sealing phase of its new factory building in Jiangyin.

The construction of the JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project commenced in July 2022, and the overall progress is proceeding as planned. This project focuses on cutting-edge high-performance packaging technologies, including 2.5D/3D high-density wafer-level packaging. It offers comprehensive services ranging from design to manufacturing, meeting the increasing market demand for high-performance chips from global customers. The completion and operational readiness of the project’s first phase are scheduled for early 2024.

With the rapid development of AI, high-performance computing (HPC), 5G, and other fields, the market demand for high-performance chip packaging technology continues to surge. According to Yole, the global market volume of advanced packaging is projected to reach 65 billion US dollars by 2027, with a CAGR of 9.6% from 2021 to 2027. JCET aims to leverage its global technological resources and enhance its high-end production capacity, strengthening the company's competitiveness in the global market.

Mr. Li Zheng, CEO of JCET, said, “JCET will continue to increase investment in cutting-edge technology and resources, making contributions to the high-quality development of the integrated circuit industry.”